1. product pro?le 1.1 general description pnp/pnp double resistor-equipped transistors (ret) in surface-mounted device (smd) plastic packages 1.2 features 1.3 applications 1.4 quick reference data PEMB30; pumb30 pnp/pnp double resistor-equipped transistors; r1 = 2.2 k w , r2 = open rev. 02 2 september 2009 product data sheet table 1. product overview type number package npn/pnp complement npn/npn complement nxp jeita PEMB30 sot666 - pemd30 pemh30 pumb30 sot363 sc-88 pumd30 pumh30 n 100 ma output current capability n reduces component count n built-in bias resistors n reduces pick and place costs n simpli?es circuit design n low current peripheral driver n cost-saving alternative for bc857bs and bc857bv n control of ic inputs table 2. quick reference data symbol parameter conditions min typ max unit per transistor v ceo collector-emitter voltage open base - - - 50 v i o output current - - - 100 ma r1 bias resistor 1 (input) 1.54 2.2 2.86 k w
PEMB30_pumb30_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 2 september 2009 2 of 10 nxp semiconductors PEMB30; pumb30 pnp/pnp double resistor-equipped transistors; r1 = 2.2 k w , r2 = open 2. pinning information 3. ordering information 4. marking [1] * = -: made in hong kong * = p: made in hong kong * = t: made in malaysia * = w: made in china table 3. pinning pin description simpli?ed outline symbol 1 gnd (emitter) tr1 2 input (base) tr1 3 output (collector) tr2 4 gnd (emitter) tr2 5 input (base) tr2 6 output (collector) tr1 001aab555 6 4 5 1 3 2 654 1 23 tr1 tr2 r1 r1 006aaa268 table 4. ordering information type number package name description version PEMB30 - plastic surface-mounted package; 6 leads sot666 pumb30 sc-88 plastic surface-mounted package; 6 leads sot363 table 5. marking codes type number marking code [1] PEMB30 2t pumb30 *b2
PEMB30_pumb30_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 2 september 2009 3 of 10 nxp semiconductors PEMB30; pumb30 pnp/pnp double resistor-equipped transistors; r1 = 2.2 k w , r2 = open 5. limiting values [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. [2] re?ow soldering is the only recommended soldering method. 6. thermal characteristics [1] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. [2] re?ow soldering is the only recommended soldering method. table 6. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit per transistor v cbo collector-base voltage open emitter - - 50 v v ceo collector-emitter voltage open base - - 50 v v ebo emitter-base voltage open collector - - 5v i o output current - - 100 ma i cm peak collector current single pulse; t p 1ms - - 100 ma p tot total power dissipation t amb 25 c sot363 [1] - 200 mw sot666 [1] [2] - 200 mw per device p tot total power dissipation t amb 25 c sot363 [1] - 300 mw sot666 [1] [2] - 300 mw t stg storage temperature - 65 +150 c t j junction temperature - 150 c t amb ambient temperature - 65 +150 c table 7. thermal characteristics symbol parameter conditions min typ max unit per transistor r th(j-a) thermal resistance from junction to ambient in free air sot363 [1] - - 625 k/w sot666 [1] [2] - - 625 k/w per device r th(j-a) thermal resistance from junction to ambient in free air sot363 [1] - - 416 k/w sot666 [1] [2] - - 416 k/w
PEMB30_pumb30_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 2 september 2009 4 of 10 nxp semiconductors PEMB30; pumb30 pnp/pnp double resistor-equipped transistors; r1 = 2.2 k w , r2 = open 7. characteristics table 8. characteristics t amb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit per transistor i cbo collector-base cut-off current v cb = - 50 v; i e =0a - - - 100 na i ceo collector-emitter cut-off current v ce = - 30 v; i b =0a - - - 1 m a v ce = - 30 v; i b =0a; t j = 150 c -- - 50 m a i ebo emitter-base cut-off current v eb = - 5 v; i c =0a - - - 100 na h fe dc current gain v ce = - 5 v; i c = - 20 ma 30 - - v cesat collector-emitter saturation voltage i c = - 10 ma; i b = - 0.5 ma - - - 150 mv r1 bias resistor 1 (input) 1.54 2.2 2.86 k w c c collector capacitance v cb = - 10 v; i e =i e =0a; f=1mhz --3pf v ce = - 5v (1) t amb = 100 c (2) t amb =25 c (3) t amb = - 40 c i c /i b =20 (1) t amb = 100 c (2) t amb =25 c (3) t amb = - 40 c fig 1. dc current gain as a function of collector current; typical values fig 2. collector-emitter saturation voltage as a function of collector current; typical values i c (ma) - 10 - 1 - 10 2 - 10 - 1 006aaa691 200 300 100 400 500 h fe 0 (1) (2) (3) 006aaa692 i c (ma) - 10 - 1 - 10 2 - 10 - 1 - 10 - 1 - 1 v cesat (v) - 10 - 2 (3) (2) (1)
PEMB30_pumb30_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 2 september 2009 5 of 10 nxp semiconductors PEMB30; pumb30 pnp/pnp double resistor-equipped transistors; r1 = 2.2 k w , r2 = open 8. package outline 9. packing information [1] for further information and the availability of packing methods, see section 13 . [2] t1: normal taping [3] t2: reverse taping fig 3. package outline sot363 (sc-88) fig 4. package outline sot666 06-03-16 dimensions in mm 0.25 0.10 0.3 0.2 pin 1 index 1.3 0.65 2.2 2.0 1.35 1.15 2.2 1.8 1.1 0.8 0.45 0.15 13 2 4 65 dimensions in mm 04-11-08 1.7 1.5 1.7 1.5 1.3 1.1 1 0.18 0.08 0.27 0.17 0.5 pin 1 index 123 4 5 6 0.6 0.5 0.3 0.1 table 9. packing methods the indicated -xxx are the last three digits of the 12nc ordering code. [1] type number package description packing quantity 3000 4000 8000 10000 PEMB30 sot666 2 mm pitch, 8 mm tape and reel - - -315 - 4 mm pitch, 8 mm tape and reel - -115 - - pumb30 sot363 4 mm pitch, 8 mm tape and reel; t1 [2] -115 - - -135 4 mm pitch, 8 mm tape and reel; t2 [3] -125 - - -165
PEMB30_pumb30_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 2 september 2009 6 of 10 nxp semiconductors PEMB30; pumb30 pnp/pnp double resistor-equipped transistors; r1 = 2.2 k w , r2 = open 10. soldering dimensions in mm fig 5. re?ow soldering footprint sot363 (sc-88) fig 6. wave soldering footprint sot363 (sc-88) solder lands solder resist occupied area solder paste sot363_fr 2.65 2.35 0.4 (2 ) 0.6 (2 ) 0.5 (4 ) 0.5 (4 ) 0.6 (4 ) 0.6 (4 ) 1.5 1.8 dimensions in mm sot363_fw solder lands solder resist occupied area preferred transport direction during soldering 5.3 1.3 1.3 1.5 0.3 1.5 4.5 2.45 2.5 dimensions in mm
PEMB30_pumb30_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 2 september 2009 7 of 10 nxp semiconductors PEMB30; pumb30 pnp/pnp double resistor-equipped transistors; r1 = 2.2 k w , r2 = open re?ow soldering is the only recommended soldering method. fig 7. re?ow soldering footprint sot666 solder lands placement area occupied area solder paste sot666_fr 2.75 2.45 2.1 1.6 0.4 (6 ) 0.55 (2 ) 0.25 (2 ) 0.6 (2 ) 0.65 (2 ) 0.3 (2 ) 0.325 (4 ) 0.45 (4 ) 0.5 (4 ) 0.375 (4 ) 1.7 2 1.7 1.075 0.538 dimensions in mm
PEMB30_pumb30_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 2 september 2009 8 of 10 nxp semiconductors PEMB30; pumb30 pnp/pnp double resistor-equipped transistors; r1 = 2.2 k w , r2 = open 11. revision history table 10. revision history document id release date data sheet status change notice supersedes PEMB30_pumb30_2 20090902 product data sheet - PEMB30_pumb30_1 modi?cations: ? this data sheet was changed to re?ect the new company name nxp semiconductors, including new legal de?nitions and disclaimers. no changes were made to the technical content. ? figure 3 p ac kage outline so t363 (sc-88) : updated ? figure 5 re? o w solder ing f ootpr int so t363 (sc-88) : updated ? figure 6 w a v e solder ing f ootpr int so t363 (sc-88) : updated ? figure 7 re? o w solder ing f ootpr int so t666 : updated PEMB30_pumb30_1 20060331 product data sheet - -
PEMB30_pumb30_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 2 september 2009 9 of 10 nxp semiconductors PEMB30; pumb30 pnp/pnp double resistor-equipped transistors; r1 = 2.2 k w , r2 = open 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 12.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 12.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 12.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 13. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors PEMB30; pumb30 pnp/pnp double resistor-equipped transistors; r1 = 2.2 k w , r2 = open ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 2 september 2009 document identifier: PEMB30_pumb30_2 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 14. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics. . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 packing information. . . . . . . . . . . . . . . . . . . . . . 5 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 12.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 contact information. . . . . . . . . . . . . . . . . . . . . . 9 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
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